MediaTek recently announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones.
The Dimensity 720, is part of MediaTek’s 5G chipset family that includes range of chipsets from Dimensity 1000 for flagship 5G smartphones to the Dimensity 800 and 700 series for more accessible 5G mid-tier devices.
“The Dimensity 720 sets a new standard, delivering feature-packed 5G experiences and technology to devices that are more accessible to mass market consumers,” said Dr. Yenchi Lee, Deputy General Manager, Wireless Communications Business Unit, MediaTek. “This chip is highly power-efficient, has impressive performance and advanced display and imaging technologies. All of that combined will help brands usher in differentiated 5G devices for consumers around the globe.”
The 7nm Dimensity 720 SoC is integrated with the most power-efficient 5G modem in its class. It’s built with MediaTek 5G UltraSave technology which uses both network and content awareness intelligence to manage the modem's operating mode in real-time to extend battery life. The chipset also integrates impressive multimedia, connectivity and imaging features for an overall better user experience.
The chipset supports the latest connectivity technologies including two carrier aggregation (2CC CA), Voice over New Radio (VoNR) and 5G and 4G dual SIM, dual standby (DSDS) to provide users with the best possible connection.
The chipset also supports both standalone (SA) and non-standalone (NSA) sub-6GHz networks. The Dimensity 720 is designed for global sub-6GHz 5G networks in Asia, North America and Europe.
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